Polishing Pads
Polishing Pads
Uniform pressure distribution and controlled stock removal for critical finishes.
Overview
Polishing pads deliver predictable pressure distribution and work with our platens and slurry systems for final thickness, flatness, and cosmetic or functional surface quality.
Select hardness, texture, and perforation for your material and chemistry.
Typical use cases
- Final polish after lapping for Ra targets
- CMP-style processes on silicon and ceramics
- Cosmetic and functional finishes on precision optics
Specifications
| Pad types | Hard / medium / soft (series-dependent) |
|---|---|
| Backing | Pressure-sensitive or mechanical attach |
| Typical sizes | Matched to plate diameter |
| Perforation | Solid or patterned (application-specific) |
| Chemistries | CMP and ceria-compatible options |
