Lapping Plates
Lift Off Discs Lapping
Lift-off disc configurations for repeatable mounting, quick changeover, and protected wafer or part handling.
Overview
Lift-off disc setups support quick carrier changes and protect delicate wafers or thin parts during load and unload. Repeatable mounting reduces variation between operators and shifts.
Configure with our carriers and process recipes for your substrate size and thickness.
Typical use cases
- Semiconductor and electronics substrate finishing
- Thin ceramics where handling damage is a risk
- High-mix production with frequent plate or carrier swaps
Specifications
| Configuration | Lift-off disc system |
|---|---|
| Part types | Wafers, thin substrates, flat components |
| Changeover | Toolless or quick-release (series-dependent) |
| Compatibility | RAALS plate sizes per model |
| Handling | Reduced edge contact during transfer |
